Key Companies Covered in the Prepreg Market Research Report Are Hexcel Corporation (U.S.), Toray Industries (Japan), SGL Group (Germany) and other key market players.
The Global Prepreg Market size is estimated at USD 7.0 billion in 2022 and is projected to reach USD 12.6 billion by 2031, at a CAGR of 10.5%. North America held the largest share in prepreg market in 2014. Major growth in the North America region is expected from the growing aerospace & defense application.
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The prepreg market in Asia-Pacific region is growing as the application industries such as automotive, aerospace & defense, wind and electronics (PCB) is estimated to register a significant growth rate in the next five years helping the prepreg market to grow at a remarkable pace. Presence of emerging economies such as India and China are helping the prepreg market to grow in the region.
Agreement & partnership was the key strategy adopted by industry players in order to maintain growth in the prepreg market. The prepreg has wide industrial applications and agreements & partnership are paving the way for fulfilling the ever changing demand for new applications by strengthening distribution network, and to increase their presence in new regions. As a result of this, a diverse application base is developing for prepreg.
This study on prepreg market estimates its global demand and market value for 2022 and projects the expected demand and market value of the same by 2031. As a part of the quantitative analysis, the study segments the global market by type of fiber reinforcement, type of resin used, manufacturing process and applications at country level with current market estimation and forecast till 2019. The major countries covered in the report are the U.S., Canada, Germany, U.K., China, India etc. The segmentation by type of fiber reinforcement includes glass fiber prepreg, carbon fiber prepreg, and aramid fiber prepreg. The segmentation by type of resin used includes thermoset prepreg and thermoplastic prepreg. Additionally, segmentation by manufacturing process includes hot-melt process and solvent dip process; while on the basis of its application, the segmentation includes aerospace & defense, wind, automotive, sporting goods, electronics (PCB), and others.
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As a part of qualitative analysis, the research provides report with a comprehensive review of key market drivers, restraints, opportunities, and burning issues in the market.
It also includes company profiling and competitive strategies adopted by various market players including Hexcel Corporation (U.S.), Toray Industries (Japan), SGL Group (Germany), Cytec Industries Inc. (U.S.), Royal TenCate nv (Netherlands), Gurit Holding AG (Switzerland), Axiom Materials, Inc. (U.S.), Mitsubishi Rayon Co., Ltd. (Japan), Teijin Limited (Japan), and Park Electrochemical Corp. (U.S.).
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