The Business Research Company’s Advanced Packaging Technologies Global Market Report 2021: COVID 19 Growth And Change To 2030
LONDON, GREATER LONDON, UK, August 25, 2021 /EINPresswire.com/ — The growing demand for consumer electronics propels the growth of the advanced packaging market. Any electronic equipment intended to be bought and used by end-users or individuals for regular and non-commercial/professional purposes is referred to as consumer electronics (CE). Electronic devices must give more functionality with more processing power and faster speeds, resulting in increased module complexity. Advanced packaging technologies provide very reliable materials, function well, and are minimal in cost.
The global advanced packaging technologies market size is expected to grow from $4.31 billion in 2020 to $4.94 billion in 2021 at a compound annual growth rate (CAGR) of 14.7%. The growth in the advanced packaging technologies market is mainly due to the companies resuming their operations and adapting to the new normal while recovering from the COVID-19 impact, which had earlier led to restrictive containment measures involving social distancing, remote working, and the closure of commercial activities that resulted in operational challenges. The advanced packaging market is expected to reach $8.11 billion in 2025 at a CAGR of 13.2%.
The advanced packaging technologies market consists of sales of advanced packaging technologies by entities (organizations, sole traders and partnerships) that provide various packaging techniques based on parameters such as power consumption, operating conditions, measurable size, and cost. Advanced packaging technologies are a collection of techniques that include 2.5D 3D-IC, wafer-level packaging, and more. It allows integrated circuits to be enclosed in a casing, which protects metallic parts from corrosion and physical damage.
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Major players in the advanced packaging technologies industry are Amkor Technology, Intel, Advanced Semiconductor Engineering (ASE), Taiwan Semiconductor Manufacturing Company, Samsung Electronics, STATS ChipPAC, Qualcomm Technologies, IBM, Brewer Science, SÜSS Microtec, Renesas Electronics Corporation, Texas Instruments, Siliconware Precision Industries, Jiangsu Changjiang Electronics Technology, China WLCSP Co. LTD., Deca Technologies, Greatek Electronics, Powertech Technology, Sanmina Corporation, SFA Semicon, Universal Instruments Corporation, and Tongfu Microelectronics.
TBRC’s advanced packaging market report covers the main types of advanced packaging technologies, which are 3D integrated circuit, 2D integrated circuit, 2.5D integrated circuit and others. The 3D integrated circuit provides high bandwidth, small form factor, and multi-function integration in packaging. Three-Dimensional Integrated Circuit (3DIC) is a packaging technology that collects and stacks homogeneous or heterogeneous dies vertically into Multi-Chip-Module (MCM) with Through-Silicon-Via (TSV). The various types of products include active packaging, smart and intelligent packaging and are implemented in various verticals such as automotive and transport, consumer electronics, industrial, IT and telecommunication, others.
Advanced Packaging Technologies Global Market Report 2021 – By Type (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit), By Product (Active Packaging, Smart And Intelligent Packaging), By End Use Industry (Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication), COVID-19 Growth And Change is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market overview, forecast advanced packaging technologies market size and growth for the whole market, advanced packaging technologies market segments, and geographies, advanced packaging technologies market trends, advanced packaging technologies market drivers, restraints, leading competitors’ revenues, profiles, and market shares.
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